Qualcomm reballing stencil full set (24pcs/set) for all qualcomm series
Features:
Precise alignment/Fast and convenient/High-temperature resistance/No deformation
The real machine is measured to ensure accuracy, and each stencil is checked according to the original factory drawings to ensure that every solder joint cannot be missing
It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips
Ultra-thin design, better fit of tin planting, continuous bending, and full toughness
Suitable for Qualcomm Snapdragon 888/SM8350/845/SMD845/765G/SM7250/855/SM8150/865 Large/SM8250-002/865 Small/SM8250/8Gen1/SM8450/888/SM8350 Anti-Short Circuit Isolation/780/775/SM7350/ 778G/SM7325
High-quality special steel is selected, which has good high-temperature resistance and metal fatigue resistance so that each tin point is heated evenly
The round and square precise hole position makes the solder balls more rounded and prevents the mesh holes from jamming the solder balls
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