“YCS H03 Pro Full Series Chip Ring Clamp for Mobile Phone Repair Motherboard Chip CPU Repair Scraping Tin Degumming Clamp Tool” has been added to your cart. View cart Remove item Thumbnail image Product Price Quantity Subtotal × U-IP9 AMAOE STENCILS IP13-A15 FOR IP13\PRO\MAX\MINI 0.12MM ₨ 400.00 U-IP9 AMAOE STENCILS IP13-A15 FOR IP13\PRO\MAX\MINI 0.12MM quantity ₨ 400.00 × MQ-2 AMAOE STENCIL INCLUDED IC (MSM8909W RAM, MT6761V, MT6779V, MT6758V, MSM8909W CPU, SDM439, MT6765V, MT6768V)0.12MM ₨ 400.00 MQ-2 AMAOE STENCIL INCLUDED IC (MSM8909W RAM, MT6761V, MT6779V, MT6758V, MSM8909W CPU, SDM439, MT6765V, MT6768V)0.12MM quantity ₨ 400.00 × L3 dot matrix activation expansion board 13-17PM series ₨ 4,000.00 L3 dot matrix activation expansion board 13-17PM series quantity ₨ 4,000.00 × YCS H03 Pro Full Series Chip Ring Clamp for Mobile Phone Repair Motherboard Chip CPU Repair Scraping Tin Degumming Clamp Tool ₨ 2,000.00 YCS H03 Pro Full Series Chip Ring Clamp for Mobile Phone Repair Motherboard Chip CPU Repair Scraping Tin Degumming Clamp Tool quantity ₨ 2,000.00 Update cart Cart totals Subtotal ₨ 6,800.00 Shipment Enter your address to view shipping options. Calculate shipping Country / region Select a country / region… Nepal State / County City: Postcode / ZIP: Update Total ₨ 6,800.00 Proceed to checkout