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Remove item Thumbnail image Product Price Quantity Subtotal
× safety Eagle blade for disassemble display back panal and cutting process for mobole repair safety Eagle blade for disassemble display back panal and cutting process for mobole repair  100.00
 100.00
× Mijing dot matrix project flex repair for iphone 11 and 12 series Mijing dot matrix project flex repair for iphone 11 and 12 series  2,000.00
 2,000.00
× 1 compressed LB H7 BGA 110 NAND Module  15,000.00
 15,000.00
× 20l RELIFE ST-20L Precision tweezers for chip placement  550.00
 550.00

Cart totals

Subtotal  17,650.00
Shipment Enter your address to view shipping options.
Total  17,650.00

Your Cart

4
20l

RELIFE ST-20L Precision tweezers for chip placement

You Saved 8%
Quantity
 600.00  550.00
1 compressed

LB H7 BGA 110 NAND Module

You Saved 3%
Quantity
 15,500.00  15,000.00
Payment Details
Sub Total  17,650.00
Enter your address to view shipping options.
Total  17,650.00