* Brand:2UUL
* Type: Solder Tin Paste
* Weight: 50g
* Use: Great for BGA Stencil Reballing
* No false welding/less residue
* Good conductivity/no cleaning
* Oxidation resistance
* Not easy to crack
* Easy to tin
* Brand:2UUL
* Type: Solder Tin Paste
* Weight: 50g
* Use: Great for BGA Stencil Reballing
* No false welding/less residue
* Good conductivity/no cleaning
* Oxidation resistance
* Not easy to crack
* Easy to tin
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
touch screen: Soft silicone, can be freely touched, no crease. waterproof: Made of highquality materials, the film is environmentally friendly and durable, with good waterproof performance. customize: You can send photo or photo to your personalized content, and we will not tell us a message of us
Features: – Industrial strength – Soft, heavt duty, medium viscosity, low odor – Waterproof, shock resistant, flexible – Fast bonding, great applicability – Easy to use, just take the cap off and press Notice: 1. Irritation to the skin and eyes, please in well-ventilated environment. 2. In case of contacting with eyes, please rinse with …
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