* Brand:2UUL
* Type: Solder Tin Paste
* Weight: 50g
* Use: Great for BGA Stencil Reballing
* No false welding/less residue
* Good conductivity/no cleaning
* Oxidation resistance
* Not easy to crack
* Easy to tin
* Brand:2UUL
* Type: Solder Tin Paste
* Weight: 50g
* Use: Great for BGA Stencil Reballing
* No false welding/less residue
* Good conductivity/no cleaning
* Oxidation resistance
* Not easy to crack
* Easy to tin
UNIVERSAL LIQUIC FOR FRAME RL-518 1. Suitable for many model China mobile ,for example R7/R7S/R7P/R9/R9P/R11/R11P/X6/X7/X7P/X9/X9SP/X20 etc. 2. Special effects on the PUR ,suitable for IP Xr/Xs/X/8/8P 3. The effect is significant, just a little can be effective, saving cost and time 4. no hurt the flex cable ,no hurt the Lcd ,no hurt the frame.
Product Information Packaging Flux Packaging 100gm Packaging box Features appropriate for many PCB reflows AMTECH Brand Product Information ASM 100g Soldering Flux Welding Paste, AMTECH NC-223, Excellent solder stickiness capacity Excellent resistance to moisture often used in flip chip operations, PGA, BGA, and CSP packages appropriate for many PCB reflows Lead-free and No-clean for the …
Low Temperature SMT Lead-Free Solder Paste, Kaisi 138°C, 40G Description: Manufacturer: KAISI Country of origin: CN Yes, certification 138 DEGREE is the model number. Size of Particles: 20-38 m Name: SMT solder paste with high compatibility Melting point is 138 °C. 40G Specifications Environment for storage: 0–10°C one year Type 1 applicable: Circuit soldering Type …
KAISI 138°C LOW TEMPERATURE SMT LEAD FREE SOLDER PASTE – 40GRead More
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