AMAOE PPD 183 DEGREE FOR IC REBALLING
₨ 650.00
Amaoe 50g Soldering Paste For BGA Stencil Reballing
Specification:
Type: Solder Tin Paste
Weight: 50g
Model: M10
Low-Temperature Melting Point: 138℃
Medium-Temperature Melting Point: 183℃
High-Temperature Melting Point: 217℃
Great for BGA Stencil Reballing
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