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AMAOE PPD 183 DEGREE FOR IC REBALLING

₨ 650.00

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Amaoe 50g Soldering Paste For BGA Stencil Reballing

Specification:

Type: Solder Tin Paste
Weight: 50g
Model: M10
Low-Temperature Melting Point: 138℃
Medium-Temperature Melting Point: 183℃
High-Temperature Melting Point: 217℃
Great for BGA Stencil Reballing

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₨ 36,250.00

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JCID BGA315 Module

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Sub Total ₨ 36,250.00
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Total ₨ 36,250.00