attributes:
First-class blade: primarily utilized for disassembling small chips or extracting their adhesive.
2# blade: primarily used to take large chips apart or peel their adhesive.
3-layer or single-layer CPU chip disassembly and glue removal are the primary uses for this blade.
The 4# blade is a tool made specifically for Android fonts, but it can also be used to take apart other chips.
The 5# blade is ideal for narrow gaps and corners and is used for chip hooking and scraping glue.
The 6# blade is mostly used to disassemble the WiFi IC, baseband, and Nand flash.
Blade handle: made of foreign material; light, flexible, anti-static, resistant to high temperatures, and easy to use.