## LB Low Temperature Solder Paste 138°C
The **LB Low Temperature Solder Paste 138°C** is designed for precision electronics repair and micro-soldering applications where controlled, low-temperature soldering is required. With a melting temperature of approximately **138°C**, it helps reduce thermal stress on sensitive PCBs, components, and FPCs during repair work.
Its fine solder particles provide smooth and consistent soldering, making it suitable for motherboard repair, IC rework, component replacement, and other delicate electronics applications. The paste spreads evenly and supports reliable solder joints when used with the appropriate soldering equipment.
### Key Features
* **Low melting temperature:** Approx. 138°C
* Helps minimize heat exposure to sensitive components
* Suitable for precision motherboard and PCB repair
* Fine solder particles for controlled application
* Supports smooth and consistent solder joints
* Ideal for micro-soldering and electronic component rework
* Suitable for professional mobile phone repair technicians
### Applications
* Smartphone motherboard repair
* PCB and IC rework
* FPC and small component soldering
* Component replacement
* Micro-soldering and precision electronics repair






