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Mbga-IP 22 IN 1 BGA Reballing Platform For iPhone 7 to 14 Pro Max WITH NAND IC, WIFI IC CPU

 6,000.00

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Option: Mbga-IP 22 in 1 set(7-14PM)

Mbga-IP 22 in 1 set(7-14PM)

14/14P kit Positioning plate

12/13 kit Positioning plate

XS/11 kit Positioning plate

7/8/X Qualcomm kit Positioning plate

7/8/X Intel Kit Positioning plate

M-IP14-A16 stencil Kit

M-IP14-A15 stencil Kit

M-IP13 stencil Kit

M-IP12 stencil Kit

M-IP11 stencil Kit

M-IPXS stencil Kit

M-IP8 Qualcomm stencil

M-IP8-i Intel stencil

M-IP7 Qualcomm stencil

M-IP7-i Intel stencil

Mbga/MFix-UBase base

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 5,200.00

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U-IP10 AMAOE BGA STENCILS IP14-A16 FOR IP14\PLUS\PRO\MAX 0.12MM

U-IP10 AMAOE BGA STENCILS IP14-A16 FOR IP14\PLUS\PRO\MAX 0.12MM

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 4,800.00
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Sub Total  5,200.00
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Total  5,200.00