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Mechanic QC-20 BGA IC Glue Remover Liquid

Original price was: ₨ 700.00.Current price is: ₨ 600.00.

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Description.
BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
The ingredients of it is environmental protection and safe.
It has good permeability;
it can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.

Relife M-16 microscope 4K camera 30/fps

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 35,900.00

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GVM-T210 iron set

GVM-T210 iron set

You Saved 23%
Quantity
 8,000.00  6,200.00
SUGON AIFEN A5 PRO INTELLIGENT SOLDERING STATION WITH ADJUSTABLE CHANNEL

SUGON AIFEN A5 PRO INTELLIGENT SOLDERING STATION WITH ADJUSTABLE CHANNEL

You Saved 6%
Quantity
 9,000.00  8,500.00
20l

RELIFE ST-20L Precision tweezers for chip placement

You Saved 8%
Quantity
 600.00  550.00
Payment Details
Sub Total  35,900.00
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Total  35,900.00