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Mechanic QC-20 BGA IC Glue Remover Liquid

Original price was: ₨ 700.00.Current price is: ₨ 600.00.

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Description.
BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
The ingredients of it is environmental protection and safe.
It has good permeability;
it can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.

Relife M-16 microscope 4K camera 30/fps

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 12,500.00

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iPhone 15 chip read and write test rack

Quantity
 10,500.00
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RELIFE RL-728A 2D sturdy mobile phone repair screwdriver set

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Sub Total  12,500.00
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Total  12,500.00