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RELIFE 210-BO Tip Soldering lron / Ball Head

 600.00

# RELIFE 210-BO Tip Soldering Iron / Ball Head

The **RELIFE 210-BO Tip Soldering Iron / Ball Head** is a precision soldering accessory designed for **mobile phone motherboard repair, micro-soldering, and fine electronic component work**. Its ball-head tip design provides controlled solder application for detailed repair tasks.

### Key Features

* **RELIFE 210-BO soldering iron tip**
* Ball-head tip design
* Designed for precision micro-soldering
* Suitable for mobile phone motherboard repair
* Useful for small components and solder joints
* Supports detailed PCB and electronics servicing
* Suitable for professional repair technicians and workshops

### Applications

The RELIFE 210-BO Ball Head Soldering Tip is suitable for:

* Mobile phone motherboard repair
* Micro-soldering
* PCB repair
* IC and small component soldering
* Solder joint repair
* Connector and FPC soldering
* Component replacement
* Precision electronics servicing

### Product Specifications

| Specification | Details |
| —————— | ——————————————– |
| **Product Name** | RELIFE 210-BO Tip Soldering Iron / Ball Head |
| **Brand** | RELIFE |
| **Model** | 210-BO |
| **Product Type** | Soldering Iron Tip |
| **Tip Design** | Ball Head |
| **Application** | Micro-soldering & PCB repair |
| **Usage** | Component-level repair |
| **Intended Users** | Professional Repair Technicians |

### Package Includes

* **1 × RELIFE 210-BO Ball Head Soldering Iron Tip**

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