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RELIFE F-23 218 SOLDER PASTE (100GR)

 650.00

Redlife F-23 Solder paste (100 Grams)

Suitable for welding and ball planting of computer north and south bridges, graphics cards, mobile phone chips, video game chips, etc.

Non-migratory for balling

Good fluidity, less residue

Good tinning property

High insulation resistance, easy to tin

Non-corrosive

Bright solder joints

No false solder joints, no need for rework

Low smoke

No irritating odor

Anti-oxidation

High quality, more solid soldering

Soft and delicate paste

Good tinning property, high insulation resistance, easy to tin

Repair drag soldering

BGA tinning

Component welding

LED lighting

SMT patch

Enhance solder fluidity and help solder wettability

High insulation resistance, safe and non-conductive

No resistance, non-conductive, strong solderability

Easy to solder, easy to clear, no irritating odour, environmentally friendly solder resist rosin

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