RELIFE F-23 218 SOLDER PASTE (100GR)
₨ 650.00
Redlife F-23 Solder paste (100 Grams)
Suitable for welding and ball planting of computer north and south bridges, graphics cards, mobile phone chips, video game chips, etc.
Non-migratory for balling
Good fluidity, less residue
Good tinning property
High insulation resistance, easy to tin
Non-corrosive
Bright solder joints
No false solder joints, no need for rework
Low smoke
No irritating odor
Anti-oxidation
High quality, more solid soldering
Soft and delicate paste
Good tinning property, high insulation resistance, easy to tin
Repair drag soldering
BGA tinning
Component welding
LED lighting
SMT patch
Enhance solder fluidity and help solder wettability
High insulation resistance, safe and non-conductive
No resistance, non-conductive, strong solderability
Easy to solder, easy to clear, no irritating odour, environmentally friendly solder resist rosin
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