RELIFE RL-093A/B/C Chip heat sink copper sheet 0.1mm/0.3mm/0.5mm

RELIFE RL-093 Series Chip Heat Sink Copper Sheet is a premium-quality thermal copper shim specially designed for professional electronics repair and advanced heat management. Manufactured from high-purity pure copper, it provides exceptional thermal conductivity, allowing heat to transfer rapidly and evenly from CPU, IC, GPU, PMIC, NAND, and other sensitive chips to the heatsink or surrounding cooling surface.

Available in three thickness options—RL-093A (0.1mm), RL-093B (0.3mm), and RL-093C (0.5mm)—this copper sheet gives technicians the flexibility to select the perfect thickness for different repair and thermal gap requirements. Its ultra-smooth surface ensures maximum contact with electronic components, resulting in improved heat dissipation and enhanced device stability.

Designed for mobile phone, tablet, laptop, gaming console, graphics card, and motherboard repair, the RELIFE RL-093 Series effectively reduces chip temperatures, minimizes overheating, and helps protect nearby ICs from excessive heat during soldering and rework procedures.

Key Features
Premium high-purity copper material for superior thermal conductivity.
Fast and uniform heat distribution for maximum cooling efficiency.
Available in three thicknesses:
RL-093A – 0.1mm
RL-093B – 0.3mm
RL-093C – 0.5mm
Smooth, flat surface for excellent chip contact.
Corrosion-resistant and oxidation-resistant for long service life.
Precision-cut design suitable for professional repair work.
Helps improve cooling performance and device reliability.
Reduces hotspot formation on CPUs, ICs, GPUs, and other heat-generating components.
Easy to install and compatible with thermal paste or thermal pads.
Ideal for both professional technicians and DIY electronics enthusiasts.
Applications
Smartphone motherboard repair
CPU & GPU cooling
IC heat dissipation
PMIC & NAND flash protection
Laptop motherboard maintenance
Graphics card thermal modification
Gaming console repair
Electronic PCB thermal management
Chip-level soldering and rework
Specifications
Brand: RELIFE
Model: RL-093 Series
Material: High-Purity Copper
Thickness Options:
RL-093A: 0.1mm
RL-093B: 0.3mm
RL-093C: 0.5mm
Surface: Smooth Precision Finish
Feature: High Thermal Conductivity
Color: Copper
Usage: Chip Cooling & Heat Dissipation
Package Includes
50 × RELIFE RL-093 Copper Heat Sink Sheets (Selected Thickness)

Upgrade your repair toolkit with the RELIFE RL-093 Series Copper Heat Sink Sheet and experience professional-grade thermal performance, faster heat transfer, improved cooling efficiency, and reliable protection for delicate electronic components during repair and long-term operation.