1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
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RELIFE F-21 New emulsified advanced solder flux set
₨ 600.00Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00. -
Relife RL-035E 10cc High-strength Bonding Chip Seam Beautification Repair Glue
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RELIFE RL-035B Mobile phone frame caulking glue/clear/black color 30ml
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RELIFE RL-035A PP structural adhesive 30CC transparent/black 30CC
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