1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
Product Information Packaging Flux Packaging 100gm Packaging box Features appropriate for many PCB reflows AMTECH Brand Product Information ASM 100g Soldering Flux Welding Paste, AMTECH NC-223, Excellent solder stickiness capacity Excellent resistance to moisture often used in flip chip operations, PGA, BGA, and CSP packages appropriate for many PCB reflows Lead-free and No-clean for the …
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