1.Highly effective removal of oxide layers, Quickly remove cyanide deposits from the soldering iron tip’s contact surface to restore its shine.
2.Restore soldering iron tips to achieve regeneration, enabling efficient repair and reuse.
1.Highly effective removal of oxide layers, Quickly remove cyanide deposits from the soldering iron tip’s contact surface to restore its shine.
2.Restore soldering iron tips to achieve regeneration, enabling efficient repair and reuse.
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
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