Features:
High-Quality Solder Paste for Phone Mainboard BGA SMD PCB Reballing Repair
Running tin is fast, less smoke
No-clean, easy to tin, no residue
Applicable to mobile phone PCB, BGA, and PGA rework
Net: 100g
Features:
High-Quality Solder Paste for Phone Mainboard BGA SMD PCB Reballing Repair
Running tin is fast, less smoke
No-clean, easy to tin, no residue
Applicable to mobile phone PCB, BGA, and PGA rework
Net: 100g
DESCRIPTION REVIEWS (0) Strong tin drag, good conductivity, no cleaning. Good wettability, full solder joints, bright and even solder joints. Printing in PCB can still maintain its viscosity for a long time without deformation and collapse. For circuits with spacing of 0.3mm
Product Information Packaging Flux Packaging 100gm Packaging box Features appropriate for many PCB reflows AMTECH Brand Product Information ASM 100g Soldering Flux Welding Paste, AMTECH NC-223, Excellent solder stickiness capacity Excellent resistance to moisture often used in flip chip operations, PGA, BGA, and CSP packages appropriate for many PCB reflows Lead-free and No-clean for the …
B-7000 Glue Clear is a high viscosity adhesive that is perfect for rhinestone crafts, jewelry, and beadwork. It can also be used for repairing fabrics, shoes, metals, and glass. It is supposed to be waterproof and works well with fabrics, drying quickly with no mess. The glue has a small opening, making it easy to …
B7000 super adhesive glue for display while doing mobile repair workRead More
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