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Rl-223-OR RELIFE FLUX PASTE FOR MOBILE REPAIR

 900.00

Features:
High-Quality Solder Paste for Phone Mainboard BGA SMD PCB Reballing Repair
Running tin is fast, less smoke
No-clean, easy to tin, no residue
Applicable to mobile phone PCB, BGA, and PGA rework
Net: 100g

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 3,000.00

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chip wifi jcid iphone 15 15 plus fixoem mexico 3 compressed

JCID 15/15plus series wifi chip

Quantity
 3,000.00
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Sub Total  3,000.00
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Total  3,000.00