Features:
High-Quality Solder Paste for Phone Mainboard BGA SMD PCB Reballing Repair
Running tin is fast, less smoke
No-clean, easy to tin, no residue
Applicable to mobile phone PCB, BGA, and PGA rework
Net: 100g
Features:
High-Quality Solder Paste for Phone Mainboard BGA SMD PCB Reballing Repair
Running tin is fast, less smoke
No-clean, easy to tin, no residue
Applicable to mobile phone PCB, BGA, and PGA rework
Net: 100g
Product Description – Only for Sarawak. Please PM to post by BAS as it’s safer, quicker, won’t kena reject. – Can be used to clean flight controller, ESC, motherboard, GPU, and many more similar PCB. – Very high quality cleaning effect. – The product is free of harmful substances such as chlorofluorocarbons and toluene. Mechanic …
DESCRIPTION REVIEWS (0) Strong tin drag, good conductivity, no cleaning. Good wettability, full solder joints, bright and even solder joints. Printing in PCB can still maintain its viscosity for a long time without deformation and collapse. For circuits with spacing of 0.3mm
Low Temperature SMT Lead-Free Solder Paste, Kaisi 138°C, 40G Description: Manufacturer: KAISI Country of origin: CN Yes, certification 138 DEGREE is the model number. Size of Particles: 20-38 m Name: SMT solder paste with high compatibility Melting point is 138 °C. 40G Specifications Environment for storage: 0–10°C one year Type 1 applicable: Circuit soldering Type …
KAISI 138°C LOW TEMPERATURE SMT LEAD FREE SOLDER PASTE – 40GRead More
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