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₨ 2,600.00

“Charging Connector Flex / PCB Board for Apple iPhone 16 Pro Max-High Copy” has been added to your cart. View cart

S23 Ultra Amaoe double layer motherboard stencils for Reballing

₨ 450.00

Description

The stencil is 0.12mm thickness

Category: STENCILS

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₨ 2,600.00

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Charging Connector Flex / PCB Board for Apple iPhone 16 Pro Max-High Copy

Quantity

₨ 1,100.00

YCS S550A Grey Thickened Silicone Pad High Temperature Resistant Insulation Non-bulging Phone Repair Mat Tools

Quantity

₨ 1,500.00

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Sub Total ₨ 2,600.00

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Total ₨ 2,600.00

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S23 Ultra Amaoe double layer motherboard stencils for Reballing

EMMC-1 AMAOE STENCIL INCLUDED (BGA221, BGA153, BGA169, BGA254, BGA162, BGA186)0.12MM

U-IP8 AMAOE BGA STENCIL IP12 FOR IP12\PRO\MAX\MINI 0.12MM

EMMC-3 AMAOE STENCIL INCLUDED(EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCIE BGA162 BGA153 BGA169 BGA221 BGA178 BGA254 BGA297 BGA186)

MI-16 AMAOE STENCIL INCLUDED ( 77048E, 58080-11, VC7643, BGA153, MT6190MV, W607S13, W60A202,MT6363AW, M-6MH05, MT6368DW, MT6375P, MT6319AP, MT6895Z, RAM, MT6983Z, 78207, MT6637XP, MTK6338W, 53730-11, SC8551A)0.12MM

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Charging Connector Flex / PCB Board for Apple iPhone 16 Pro Max-High Copy

YCS S550A Grey Thickened Silicone Pad High Temperature Resistant Insulation Non-bulging Phone Repair Mat Tools

Your Cart

Your Cart

S23 Ultra Amaoe double layer motherboard stencils for Reballing

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EMMC-1 AMAOE STENCIL INCLUDED (BGA221, BGA153, BGA169, BGA254, BGA162, BGA186)0.12MM

U-IP8 AMAOE BGA STENCIL IP12 FOR IP12\PRO\MAX\MINI 0.12MM

EMMC-3 AMAOE STENCIL INCLUDED(EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCIE BGA162 BGA153 BGA169 BGA221 BGA178 BGA254 BGA297 BGA186)

MI-16 AMAOE STENCIL INCLUDED ( 77048E, 58080-11, VC7643, BGA153, MT6190MV, W607S13, W60A202,MT6363AW, M-6MH05, MT6368DW, MT6375P, MT6319AP, MT6895Z, RAM, MT6983Z, 78207, MT6637XP, MTK6338W, 53730-11, SC8551A)0.12MM

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