samung reballing stencil full set(7pcs/set)/ (Exynos8895 Exynos9815/180 Exynos2100 Exynos880/980 Exynos2200/E9925 Exynos990 Exynos9820)
₨ 1,500.00
Description:
This is a professional 7-piece reballing stencil set specifically designed for repairing and reballing Samsung smartphone chips (ICs) such as CPU, eMMC, power IC, and other BGA components. Each stencil in the set is made from high-quality stainless steel, offering precise hole patterns for accurate and efficient solder ball placement.
These stencils are widely used in mobile phone logic board repairs and chip-level soldering tasks. They support reballing BGA ICs after removing them from the motherboard, allowing technicians to place solder balls correctly before reflowing or reinstalling the chip.
Key Features:
✅ 7 stencils in one set—covers various common Samsung IC sizes and chip types
(Exynos8895, Exynos9815/180, Exynos2100, Exynos880/980, Exynos2200/E9925, Exynos990, and Exynos9820).
✅ High-precision laser-cut holes for consistent solder ball placement
✅ Compatible with Samsung BGA ICs—CPU, RAM, eMMC, power IC, etc.
✅ Durable stainless steel material—heat-resistant and reusable
✅ Essential for chip-level repair and reballing stations
Applications:
Reballing damaged or removed Samsung ICs
Mobile phone motherboard chip repair
Precision solder ball rework using hot air or reflow station
Works with solder paste or solder balls





