UV flux 559
Original price was: ₨ 1,200.00.₨ 1,000.00Current price is: ₨ 1,000.00.
Model : RMA-223-UV/NC-559-ASM
Volume : 100 g / bottle
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection
Related products
-
AMAOE PPD 138 DEGREE FOR MOBILE REPAIRING
₨ 700.00Read moreProduct Information for Amaoe Solder Paste PPD M11 138°C The distinctions between our three varieties of solder paste and their uses at high, medium, and low temperatures are as follows:1, environmentally friendly high-temperature solder paste with silver and M9 lead-free 217°: Usage Advice: It is appropriate for the master who has strict standards for maintenance …
On Sale
-
RELIFE F-21 New emulsified advanced solder flux set
Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00.
-
Relife RL-035E 10cc High-strength Bonding Chip Seam Beautification Repair Glue
Original price was: ₨ 350.00.₨ 300.00Current price is: ₨ 300.00.
-
RELIFE RL-035B Mobile phone frame caulking glue/clear/black color 30ml
Original price was: ₨ 700.00.₨ 650.00Current price is: ₨ 650.00.
-
RELIFE RL-035A PP structural adhesive 30CC transparent/black 30CC
Original price was: ₨ 800.00.₨ 750.00Current price is: ₨ 750.00.
-
RELIFE ST-20L Precision tweezers for chip placement
Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00.
