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YCS – 5.5mm 5515 Desoldering Wire Remover Wick BGA Soldering Wire (1BOX/5PCS)

 1,100.00

YCS 5.5mm 5515 Desoldering Wick / Solder Remover Wire (1 Box – 5 Pieces)

The YCS 5.5mm 5515 Desoldering Wick is a high-quality copper braid designed for efficient and precise solder removal in electronic repair and PCB rework applications. It is widely used in BGA repair, mobile phone servicing, motherboard repair, and electronic component desoldering.

Made from pure braided copper wire with flux coating, this desoldering wick quickly absorbs molten solder through capillary action, ensuring clean and smooth solder removal without damaging sensitive circuit boards.

With a wide 5.5mm size, this model is ideal for removing larger solder joints, heavy solder bridges, and cleaning wide pads on PCB boards. It is especially useful for professional technicians working on BGA chips, IC components, and multilayer circuit boards.

Key Features:
Premium quality YCS original desoldering wick (Model 5515)
Width: 5.5mm – ideal for large solder removal
Strong copper braid for fast heat transfer
Flux-coated for better solder absorption
Clean removal with minimal residue
Safe for PCB and electronic components
Suitable for professional repair use (mobile, laptop, BGA rework)
Applications:
PCB solder cleanup and repair
BGA chip rework and IC desoldering
Mobile phone motherboard repair
Electronics maintenance and prototyping
Package Includes:
1 Box of YCS Desoldering Wick 5515
Total: 5 pieces

1

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STORAGE BOX OR GRID BOX 48 in one

STORAGE BOX OR GRID BOX 48 in one

Quantity
 1,200.00