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YCS iPhone All Series (mold + stencil) – ProMax 3 in 1 middl-layer reballing platform for X-16

Description

BGA Reballing Metal Stencil for iPhone X-16 Series Motherboard? Premium Reballing Platform for Professionals
The BGA Reballing Metal Stencil is a high-precision reballing solution designed specifically for professionals working on iPhone X-16 series motherboards. Crafted from durable, high-grade stainless steel, this stencil set ensures long-lasting performance, perfect alignment, and precision soldering. making it an essential tool for advanced logic board repair.

? Trusted by repair experts worldwide
? Accurate chip-to-stencil fit with minimal deviation
? Saves time and improves workflow efficiency
? Reusable, anti-deformation, and corrosion-resistant

Category: STENCILS