Features:
Designed for mobile phones, tablet and other precision PCB design, easy to clean the BGA pad interface pins, do not hurt the peripheral components
Pure copper weaving, adsorption force increased by 30%, solder a suction that is clean, low residue
No breakpoints, oxidation, corrosion resistance, low residue, sealed packaging, compact and portable
Fast thermal conductivity, fast suction of the solder, not only to improve the efficiency of the work, but also applicable to a variety of electronic PCB circuit boards
Two specifications can be selected, the length of 1.5m Two specifications available, length 1.5m & 2m two specifications, to meet different maintenance needs
Package includes:
5 x Desoldering Wick
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