YCS Tin Planting Arc Pad – High Temperature Resistant Magnetic Pad
₨ 800.00
premium YCS IC Reballing ARC Mat — the ultimate heat-resistant silicone pad designed for professional motherboard repair, BGA reballing, chip tin planting, and precision soldering work. Built with high-temperature resistant material, this ARC pad provides a stable and anti-slip working surface that protects delicate IC chips and logic boards during repair operations.
Specially engineered for iPhone and Android motherboard technicians, the YCS ARC Mat offers excellent heat insulation, strong magnetic positioning support, and organized working zones for efficient chip alignment and reballing. Its durable silicone construction prevents deformation under high temperatures, making it perfect for long repair sessions in professional mobile repair labs.
Whether you are repairing Face ID ICs, CPU chips, NAND flash, PMIC, or performing motherboard layer separation, the YCS IC Reballing ARC Mat ensures maximum precision, safety, and convenience. The compact and lightweight design also makes it easy to carry and use anywhere.
✅ High Temperature Resistant Silicone Material
✅ Professional BGA Reballing & Tin Planting Support
✅ Anti-Slip & Anti-Static Surface
✅ Perfect for iPhone & Android Motherboard Repair
✅ Durable, Flexible & Easy to Clean
✅ Ideal for CPU, NAND, IC Chip Repair Work
✅ Trusted by Mobile Repair Technicians Worldwide
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