RELIFE RL-518 Universal liquid for remove frame disassemble bracket stent glue liquid
RELIFE RL-518 Universal liquid for remove frame disassemble bracket stent glue liquid
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
RELIFE RL-093A/B/C Chip heat sink copper sheet 0.1mm/0.3mm/0.5mm
SUNSHINE LS6 Pro Heated screen separator
RELIFE LG2 Gear Glue Remover
RELIFE RL-2020 Powerful Soldering Wick 2.0mm – Copper Desoldering Braid
RELIFE RL-1520 Powerful Desoldering Wick 1.5mm × 2m Solder Remover Braid
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