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× WhatsApp Image 2026 05 11 at 1.26.35 PM YCS Chip Adhesive Removal Heating Table 2S Rapid Chip ₨ 2,200.00
₨ 2,200.00
× mm YCS Motherboard Middle Layer Tin Planting Kit For iPhone 17 Series ₨ 1,400.00
₨ 1,400.00
× MI-14 AMAOE STENCIL INCLUDED (77033D, 77040, BGA153, BGA254, SDR868, WCN68516740, 58091-21, QPM5541, WCD9380, PMR735A, SM8350 CPU, SM8350RAM, SM7350, QPM5577, QMP5679, SMB1396, PM73500, PM8350\C, PM8350, 1619A, NXP)0.12MM MI-14 AMAOE STENCIL INCLUDED (77033D, 77040, BGA153, BGA254, SDR868, WCN68516740, 58091-21, QPM5541, WCD9380, PMR735A, SM8350 CPU, SM8350RAM, SM7350, QPM5577, QMP5679, SMB1396, PM73500, PM8350\C, PM8350, 1619A, NXP)0.12MM ₨ 400.00
₨ 400.00

Cart totals

Subtotal ₨ 4,000.00
Shipment Enter your address to view shipping options.
Total ₨ 4,000.00
Proceed to checkout

Your Cart

3
MI-14 AMAOE STENCIL INCLUDED (77033D, 77040, BGA153, BGA254, SDR868, WCN68516740, 58091-21, QPM5541, WCD9380, PMR735A, SM8350 CPU, SM8350RAM, SM7350, QPM5577, QMP5679, SMB1396, PM73500, PM8350\C, PM8350, 1619A, NXP)0.12MM

MI-14 AMAOE STENCIL INCLUDED (77033D, 77040, BGA153, BGA254, SDR868, WCN68516740, 58091-21, QPM5541, WCD9380, PMR735A, SM8350 CPU, SM8350RAM, SM7350, QPM5577, QMP5679, SMB1396, PM73500, PM8350\C, PM8350, 1619A, NXP)0.12MM

Quantity
₨ 400.00
mm

YCS Motherboard Middle Layer Tin Planting Kit For iPhone 17 Series

Quantity
₨ 1,400.00
WhatsApp Image 2026 05 11 at 1.26.35 PM

YCS Chip Adhesive Removal Heating Table 2S Rapid Chip

Quantity
₨ 2,200.00
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Sub Total ₨ 4,000.00
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Total ₨ 4,000.00

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