Name: YCS Chip Adhesive Removal Heating Table 2S Rapid Chip
SKU: 5789
Availability: InStock

YCS Chip Adhesive Removal Heating Table 2S

The YCS Chip Adhesive Removal Heating Table 2S is a professional-grade rapid heating platform specially designed for mobile phone motherboard repair, IC chip glue removal, CPU degumming, and BGA reballing work. Built for technicians and advanced repair engineers, this compact heating station delivers fast and stable temperature performance for safe chip separation and precision electronic repairs.

Featuring high-efficiency rapid heating technology, the YCS 2S quickly reaches the required working temperature, helping technicians save repair time while maintaining consistent thermal control. Its precise heating system ensures even heat distribution, reducing the risk of damaging sensitive IC chips, CPUs, NAND chips, and motherboard components during adhesive removal or soldering procedures.

The YCS 2S heating platform is widely used for:

CPU & IC chip glue removal
Mobile motherboard repair
BGA chip reballing
Hard glue softening & degumming
Electronic component desoldering
Smartphone repair & maintenance

Designed with a compact, portable, and durable body, the device is suitable for repair shops, professional technicians, and mobile repair training centers. Its user-friendly operation makes complex chip-level repair tasks faster, safer, and more efficient.

Key Features:
Rapid heating performance
Precise temperature control
Stable heating platform
Safe IC chip degumming
Compact & portable design
Professional repair tool for smartphones
Ideal for iPhone and Android motherboard repairs
Supports BGA rework and chip separation