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× mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm ₨ 550.00
₨ 550.00
× HW-1 AMAOE STENCIL INCLUDED( Kirin930/935 HI3630/HI3635 CPU/RAM For Huawei P8/mate 7/mate s/honor 7/x2 IC CHIP BGA) HW-1 AMAOE STENCIL INCLUDED( Kirin930/935 HI3630/HI3635 CPU/RAM For Huawei P8/mate 7/mate s/honor 7/x2 IC CHIP BGA) ₨ 400.00
₨ 400.00

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HW-1 AMAOE STENCIL INCLUDED( Kirin930/935 HI3630/HI3635 CPU/RAM For Huawei P8/mate 7/mate s/honor 7/x2 IC CHIP BGA)

HW-1 AMAOE STENCIL INCLUDED( Kirin930/935 HI3630/HI3635 CPU/RAM For Huawei P8/mate 7/mate s/honor 7/x2 IC CHIP BGA)

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mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm

mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm

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₨ 550.00
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