mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm
MECHANIC solder ball 10000PCS/Bottle
Our BGA solder ball has the following characteristics:
. Meet EU ROHS and REACH standards.
.With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
. Purity and sphericity are very high, no surface defects.
.Suitable for BGA, CSP and other cutting-edge packaging technology and the use of micro-welding.
.The minimum diameter of the solder ball 0.20mm, non-standard sizes can be customized according to customer requirements.
.When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.
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