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× mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm  550.00
 550.00

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Subtotal  550.00
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Total  550.00

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 550.00

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