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× mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm  550.00
 550.00
× HW-1 AMAOE STENCIL INCLUDED( Kirin930/935 HI3630/HI3635 CPU/RAM For Huawei P8/mate 7/mate s/honor 7/x2 IC CHIP BGA) HW-1 AMAOE STENCIL INCLUDED( Kirin930/935 HI3630/HI3635 CPU/RAM For Huawei P8/mate 7/mate s/honor 7/x2 IC CHIP BGA)  400.00
 400.00
× j YCS C115-J Professional Micro Soldering Cartridge  900.00
 900.00

Cart totals

Subtotal  1,850.00
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Total  1,850.00

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 1,850.00

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Sub Total  1,850.00
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Total  1,850.00