* Brand:2UUL
* Type: Solder Tin Paste
* Weight: 50g
* Use: Great for BGA Stencil Reballing
* No false welding/less residue
* Good conductivity/no cleaning
* Oxidation resistance
* Not easy to crack
* Easy to tin
* Brand:2UUL
* Type: Solder Tin Paste
* Weight: 50g
* Use: Great for BGA Stencil Reballing
* No false welding/less residue
* Good conductivity/no cleaning
* Oxidation resistance
* Not easy to crack
* Easy to tin
Product Information Packaging Flux Packaging 100gm Packaging box Features appropriate for many PCB reflows AMTECH Brand Product Information ASM 100g Soldering Flux Welding Paste, AMTECH NC-223, Excellent solder stickiness capacity Excellent resistance to moisture often used in flip chip operations, PGA, BGA, and CSP packages appropriate for many PCB reflows Lead-free and No-clean for the …
UNIVERSAL LIQUIC FOR FRAME RL-518 1. Suitable for many model China mobile ,for example R7/R7S/R7P/R9/R9P/R11/R11P/X6/X7/X7P/X9/X9SP/X20 etc. 2. Special effects on the PUR ,suitable for IP Xr/Xs/X/8/8P 3. The effect is significant, just a little can be effective, saving cost and time 4. no hurt the flex cable ,no hurt the Lcd ,no hurt the frame.
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