* Brand:2UUL
* Type: Solder Tin Paste
* Weight: 50g
* Use: Great for BGA Stencil Reballing
* No false welding/less residue
* Good conductivity/no cleaning
* Oxidation resistance
* Not easy to crack
* Easy to tin
* Brand:2UUL
* Type: Solder Tin Paste
* Weight: 50g
* Use: Great for BGA Stencil Reballing
* No false welding/less residue
* Good conductivity/no cleaning
* Oxidation resistance
* Not easy to crack
* Easy to tin
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
Product Description – Only for Sarawak. Please PM to post by BAS as it’s safer, quicker, won’t kena reject. – Can be used to clean flight controller, ESC, motherboard, GPU, and many more similar PCB. – Very high quality cleaning effect. – The product is free of harmful substances such as chlorofluorocarbons and toluene. Mechanic …
Product Specifications Material Flux Packaging Size 100gm Packaging box Features Suitable for multiple PCB reflow Brand AMTECH Product Description AMTECH NC-559-ASM 100g Soldering Flux Welding Paste Excellent capacity of solder-stickiness Excellent Anti-wet Capacity Widely used on BGA, PGA, CSP packages and flip chip operation Suitable for multiple PCB reflow No-clean and Lead free for environmental …
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