“OV-5 AMAOE STENCIL INCLUDED(OPPO & VIVO 53735 PM7250 PM7150A MT6359VPP 58255 QPM5677 77040 BGA221 SDR865 BGA153 MT6190W 78191-21 MT6635XP WCN3998-PM7250B-MT6885Z RAM – MT6885Z CPU 16-SM7250 17-MT6360PP 765G/SM7250, MTK1000L/MT6855Z CPU-0.12MM OPPO-RENO3/3PRO/4/4PRO, VIVO-X50/50 PRO/Z6, IQ00-)” has been added to your cart. View cart

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Amaoe IP X-16 28-in-1 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone series

Name: Amaoe IP X-16 28-in-1 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone series
SKU: 5348
Availability: InStock

Original price was: ₨ 8,500.00.Current price is: ₨ 8,000.00.

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Category: STENCILS

RELIFE RL-548 Solder Paste Thinner Original price was: ₨ 150.00.Current price is: ₨ 100.00.
RELIFE RL-8333 OCA/LOCA glue remover/glass bottle 20ML Original price was: ₨ 300.00.Current price is: ₨ 250.00.
RELIFE F-21 New emulsified advanced solder flux set Original price was: ₨ 600.00.Current price is: ₨ 550.00.
Relife RL-035E 10cc High-strength Bonding Chip Seam Beautification Repair Glue Original price was: ₨ 350.00.Current price is: ₨ 300.00.
RELIFE RL-035B Mobile phone frame caulking glue/clear/black color 30ml Original price was: ₨ 700.00.Current price is: ₨ 650.00.

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Amaoe IP X-16 28-in-1 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone series

U-IP6 AMAOE BGA STENCILL IPXS-A12 FOR IPXS\MAX\XR 0.12MM

U-IP9 AMAOE STENCILS IP13-A15 FOR IP13\PRO\MAX\MINI 0.12MM

U-IP10 AMAOE BGA STENCILS IP14-A16 FOR IP14\PLUS\PRO\MAX 0.12MM

EMMC-2 AMAOE STENCIL INCLUDED (EMMC/ EMCP, UFS)0.15MM

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OV-5 AMAOE STENCIL INCLUDED(OPPO & VIVO 53735 PM7250 PM7150A MT6359VPP 58255 QPM5677 77040 BGA221 SDR865 BGA153 MT6190W 78191-21 MT6635XP WCN3998-PM7250B-MT6885Z RAM – MT6885Z CPU 16-SM7250 17-MT6360PP 765G/SM7250, MTK1000L/MT6855Z CPU-0.12MM OPPO-RENO3/3PRO/4/4PRO, VIVO-X50/50 PRO/Z6, IQ00-)

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Amaoe IP X-16 28-in-1 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone series

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