Specification:Material: Plastic + Solder
PasteColor: as a picture display
Micron: 25-45um
Applications: Mobile phone repair, computer and digital service industries, high-precision SMT circuit board welding, BGA welding process, etc.
Specification:Material: Plastic + Solder
PasteColor: as a picture display
Micron: 25-45um
Applications: Mobile phone repair, computer and digital service industries, high-precision SMT circuit board welding, BGA welding process, etc.
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
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