Specification:Material: Plastic + Solder
PasteColor: as a picture display
Micron: 25-45um
Applications: Mobile phone repair, computer and digital service industries, high-precision SMT circuit board welding, BGA welding process, etc.
Specification:Material: Plastic + Solder
PasteColor: as a picture display
Micron: 25-45um
Applications: Mobile phone repair, computer and digital service industries, high-precision SMT circuit board welding, BGA welding process, etc.
Product Information Packaging Flux Packaging 100gm Packaging box Features appropriate for many PCB reflows AMTECH Brand Product Information ASM 100g Soldering Flux Welding Paste, AMTECH NC-223, Excellent solder stickiness capacity Excellent resistance to moisture often used in flip chip operations, PGA, BGA, and CSP packages appropriate for many PCB reflows Lead-free and No-clean for the …
Features: – Industrial strength – Soft, heavt duty, medium viscosity, low odor – Waterproof, shock resistant, flexible – Fast bonding, great applicability – Easy to use, just take the cap off and press Notice: 1. Irritation to the skin and eyes, please in well-ventilated environment. 2. In case of contacting with eyes, please rinse with …
DESCRIPTION REVIEWS (0) Strong tin drag, good conductivity, no cleaning. Good wettability, full solder joints, bright and even solder joints. Printing in PCB can still maintain its viscosity for a long time without deformation and collapse. For circuits with spacing of 0.3mm
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
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