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MECHANIC 004 034 Cleaning Tool BGA Glue Removal Adhesive Cut Blade Tool for Rubber Tapping Chip Prying Mainboard Disassembling
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High quality Glass Blaster – Mobile phone glass breaking machine kaisi
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RELIFE F-21 New emulsified advanced solder flux set
₨ 600.00Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00. -
Relife RL-035E 10cc High-strength Bonding Chip Seam Beautification Repair Glue
₨ 350.00Original price was: ₨ 350.00.₨ 300.00Current price is: ₨ 300.00. -
RELIFE RL-035B Mobile phone frame caulking glue/clear/black color 30ml
₨ 700.00Original price was: ₨ 700.00.₨ 650.00Current price is: ₨ 650.00. -
RELIFE RL-035A PP structural adhesive 30CC transparent/black 30CC
₨ 800.00Original price was: ₨ 800.00.₨ 750.00Current price is: ₨ 750.00. -
RELIFE ST-20L Precision tweezers for chip placement
₨ 600.00Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00.






