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RELIFE HW21S Lead-containing Silver Solder Paste / Syringe-packed 10CC / 183℃

 600.00

1.Applicable to SMT patches, BGA welding, LED patches, etc.

2.Lead and silver have better conductivity, Improved conductivity and strength, optimized 183℃ medium temperature welding process, and protection of temperature sensitive components.

3.RELIFE’s solder paste has moderate humidity, solder paste is not easy to agglomerate, easy to tin, no false soldering.

4.No false solder joints, less residue, bright solder joints, strong solder creep, good conductivity, oxidation resistance, no corrosion to PCB, no need to clean.

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 400.00

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AMAOE BGA STENCIL FOR IPHONE  IP6\6P

AMAOE BGA STENCIL FOR IPHONE IP6\6P

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Sub Total  400.00
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Total  400.00