RELIFE RL-402 solder paste /40G/183℃
₨ 500.00
RELIFE RL-402 is a high-quality solder paste specially designed for mobile phone repair, PCB soldering, BGA reballing, and other precision electronic repair applications. With a melting point of 183°C and a Sn63/Pb37 alloy composition, it provides excellent solderability, strong bonding performance, and smooth solder joints. The no-clean formula leaves minimal residue after soldering, reducing cleaning time and improving work efficiency. Its fine particle size and high viscosity ensure accurate application and reliable results for professional repair technicians. The 40g container offers long-lasting use and is suitable for both hobbyists and professionals.
Key Features:
Model: RELIFE RL-402
Net Weight: 40g
Melting Point: 183°C
Alloy: Sn63/Pb37 (Tin/Lead)
No-clean formula with low residue
High viscosity for stable application
Suitable for PCB, SMT, SMD, and BGA soldering
Strong solder joints and excellent conductivity
Ideal for mobile phone and electronics repair work
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