RELIFE RL-403S 183℃ solder paste
₨ 500.00
The RELIFE RL-403S 183°C Solder Paste is a high-performance soldering solution engineered for professional motherboard repair, BGA rework, SMT assembly, and precision electronics soldering. Designed with a fine-particle formulation and excellent wetting performance, it delivers strong, reliable solder joints while maintaining smooth and consistent application. Its 183°C melting point allows efficient soldering with reduced thermal stress on delicate electronic components.
Key Features:
✔ Low Melting Point (183°C) – Ideal for sensitive PCB and motherboard repairs.
✔ Excellent Wettability – Ensures fast, uniform solder flow and strong bonding.
✔ Fine Particle Size (20–38μm) – Perfect for BGA, SMD, and micro-electronic applications.
✔ No-Clean Formula – Leaves minimal residue, reducing post-solder cleaning requirements.
✔ High Activity Flux – Promotes reliable solder joints with superior conductivity.
✔ 10CC Syringe Design – Enables precise, waste-free dispensing for professional repair work.
✔ Long Shelf Life – Maintains performance when stored properly under refrigeration.
Applications:
Smartphone and laptop motherboard repair
BGA chip reballing and rework
SMT/SMD component installation
PCB assembly and maintenance
Precision electronic device repair
RELIFE RL-403S is trusted by technicians and electronics repair professionals for its consistent performance, strong adhesion, bright solder finish, and dependable results in demanding repair environments.
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