RELIFE RL-420S-UV Syringe type flux
₨ 350.00
1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
Related products
-
AMAOE PPD 138 DEGREE FOR MOBILE REPAIRING
₨ 700.00Read moreProduct Information for Amaoe Solder Paste PPD M11 138°C The distinctions between our three varieties of solder paste and their uses at high, medium, and low temperatures are as follows:1, environmentally friendly high-temperature solder paste with silver and M9 lead-free 217°: Usage Advice: It is appropriate for the master who has strict standards for maintenance …
-
Universal glue remover RL-518
₨ 500.00Add to cartUNIVERSAL LIQUIC FOR FRAME RL-518 1. Suitable for many model China mobile ,for example R7/R7S/R7P/R9/R9P/R11/R11P/X6/X7/X7P/X9/X9SP/X20 etc. 2. Special effects on the PUR ,suitable for IP Xr/Xs/X/8/8P 3. The effect is significant, just a little can be effective, saving cost and time 4. no hurt the flex cable ,no hurt the Lcd ,no hurt the frame.
-
AMAOE M53 PASTE 10-Cc
₨ 350.00Add to cartProduct details of Amaoe M53 10cc No Clean Smooth Flow Tracky Soldering Flux Paste For Electronics PCB IC Mobile Phone CPU LED BGA Repairing Amaoe M53 10cc No Clean Smooth Flow Tracky Soldering Flux Paste For Electronics PCB IC Mobile Phone CPU LED BGA Repairing
On Sale
-
RELIFE F-21 New emulsified advanced solder flux set
Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00.
-
Relife RL-035E 10cc High-strength Bonding Chip Seam Beautification Repair Glue
Original price was: ₨ 350.00.₨ 300.00Current price is: ₨ 300.00.
-
RELIFE RL-035B Mobile phone frame caulking glue/clear/black color 30ml
Original price was: ₨ 700.00.₨ 650.00Current price is: ₨ 650.00.
-
RELIFE RL-035A PP structural adhesive 30CC transparent/black 30CC
Original price was: ₨ 800.00.₨ 750.00Current price is: ₨ 750.00.
-
RELIFE ST-20L Precision tweezers for chip placement
Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00.
