1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
Product details of Amaoe M53 10cc No Clean Smooth Flow Tracky Soldering Flux Paste For Electronics PCB IC Mobile Phone CPU LED BGA Repairing Amaoe M53 10cc No Clean Smooth Flow Tracky Soldering Flux Paste For Electronics PCB IC Mobile Phone CPU LED BGA Repairing
RELIFE F-21 New emulsified advanced solder flux set
Relife RL-035E 10cc High-strength Bonding Chip Seam Beautification Repair Glue
RELIFE RL-035B Mobile phone frame caulking glue/clear/black color 30ml
RELIFE RL-035A PP structural adhesive 30CC transparent/black 30CC
RELIFE ST-20L Precision tweezers for chip placement
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