1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
Product Information Packaging Flux Packaging 100gm Packaging box Features appropriate for many PCB reflows AMTECH Brand Product Information ASM 100g Soldering Flux Welding Paste, AMTECH NC-223, Excellent solder stickiness capacity Excellent resistance to moisture often used in flip chip operations, PGA, BGA, and CSP packages appropriate for many PCB reflows Lead-free and No-clean for the …
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
Product details of Amaoe M53 10cc No Clean Smooth Flow Tracky Soldering Flux Paste For Electronics PCB IC Mobile Phone CPU LED BGA Repairing Amaoe M53 10cc No Clean Smooth Flow Tracky Soldering Flux Paste For Electronics PCB IC Mobile Phone CPU LED BGA Repairing
UNIVERSAL LIQUIC FOR FRAME RL-518 1. Suitable for many model China mobile ,for example R7/R7S/R7P/R9/R9P/R11/R11P/X6/X7/X7P/X9/X9SP/X20 etc. 2. Special effects on the PUR ,suitable for IP Xr/Xs/X/8/8P 3. The effect is significant, just a little can be effective, saving cost and time 4. no hurt the flex cable ,no hurt the Lcd ,no hurt the frame.
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