1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
Related products
-
UV flux 559
₨ 1,200.00Original price was: ₨ 1,200.00.₨ 1,000.00Current price is: ₨ 1,000.00.Add to cartModel : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
-
Kaisi 183℃ High quality solder ppd paste 40gm
₨ 500.00Add to cartDESCRIPTION REVIEWS (0) Strong tin drag, good conductivity, no cleaning. Good wettability, full solder joints, bright and even solder joints. Printing in PCB can still maintain its viscosity for a long time without deformation and collapse. For circuits with spacing of 0.3mm
On Sale
-
RELIFE F-21 New emulsified advanced solder flux set
₨ 600.00Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00. -
Relife RL-035E 10cc High-strength Bonding Chip Seam Beautification Repair Glue
₨ 350.00Original price was: ₨ 350.00.₨ 300.00Current price is: ₨ 300.00. -
RELIFE RL-035B Mobile phone frame caulking glue/clear/black color 30ml
₨ 700.00Original price was: ₨ 700.00.₨ 650.00Current price is: ₨ 650.00. -
RELIFE RL-035A PP structural adhesive 30CC transparent/black 30CC
₨ 800.00Original price was: ₨ 800.00.₨ 750.00Current price is: ₨ 750.00. -
RELIFE ST-20L Precision tweezers for chip placement
₨ 600.00Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00.








