RELIFE RL-559-IM flux / 100G
₨ 1,000.00
1.Imported rosin from Japan, environmentally, lead-free and halogen-free, with high safety.
2.Strong activity, good viscosity, good fluidity and easier tinning.
3.Milky white paste, no residue, fast tinning.
4.High insulation resistance, suitable for mobile phone motherboards, cpu repair, etc.
5.All goods QC passed before sale ,and have a product inspection report,quality assurance
Related products
-
WOWSOME RELIFE RL-070 Soldering Paste Carton Rosin Soldering Iron Soft Solder 0 W Simple
₨ 100.00Add to cartDescription: Small Carton Rosin Soldering Iron Welding Fluxes, Carton Rosin Soldering Iron Soft Solder Welding Fluxes for mobile phone repair, high-quality Carton Rosin for phone repair BGA rework soldering iron, phone repair Soldering Iron Soft Solder Welding Fluxes Small Carton Rosin Soldering Iron Welding flux for phone repair Item Specific: Material:Natural resin Viscosity: 100(Pa·S) Granularity: …
WOWSOME RELIFE RL-070 Soldering Paste Carton Rosin Soldering Iron Soft Solder 0 W SimpleRead More
-
AMTECH FLUX NC-559 PASTE 100gm
₨ 1,000.00Add to cartProduct Specifications Material Flux Packaging Size 100gm Packaging box Features Suitable for multiple PCB reflow Brand AMTECH Product Description AMTECH NC-559-ASM 100g Soldering Flux Welding Paste Excellent capacity of solder-stickiness Excellent Anti-wet Capacity Widely used on BGA, PGA, CSP packages and flip chip operation Suitable for multiple PCB reflow No-clean and Lead free for environmental …
-
KAISI 138°C LOW TEMPERATURE SMT LEAD FREE SOLDER PASTE – 40G
₨ 500.00Add to cartLow Temperature SMT Lead-Free Solder Paste, Kaisi 138°C, 40G Description: Manufacturer: KAISI Country of origin: CN Yes, certification 138 DEGREE is the model number. Size of Particles: 20-38 m Name: SMT solder paste with high compatibility Melting point is 138 °C. 40G Specifications Environment for storage: 0–10°C one year Type 1 applicable: Circuit soldering Type …
KAISI 138°C LOW TEMPERATURE SMT LEAD FREE SOLDER PASTE – 40GRead More
On Sale
-
RELIFE F-21 New emulsified advanced solder flux set
Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00.
-
Relife RL-035E 10cc High-strength Bonding Chip Seam Beautification Repair Glue
Original price was: ₨ 350.00.₨ 300.00Current price is: ₨ 300.00.
-
RELIFE RL-035B Mobile phone frame caulking glue/clear/black color 30ml
Original price was: ₨ 700.00.₨ 650.00Current price is: ₨ 650.00.
-
RELIFE RL-035A PP structural adhesive 30CC transparent/black 30CC
Original price was: ₨ 800.00.₨ 750.00Current price is: ₨ 750.00.
-
RELIFE ST-20L Precision tweezers for chip placement
Original price was: ₨ 600.00.₨ 550.00Current price is: ₨ 550.00.
